ADW CHIP FAN: MEMS-Based Micro Jet Cooling Redefines Active Thermal Management

As electronic devices continue to become smaller, more powerful, and increasingly integrated, thermal management has emerged as one of the key challenges in system design. ADW introduces the CHIP FAN, an innovative MEMS-based micro jet cooling solution that brings active cooling directly to the chip level.

Manufactured using advanced MEMS technology, the CHIP FAN measures only 13 × 13 × 2.4 mm while consuming just 0.2 W of power. Despite its miniature size, it delivers an airflow of 0.2 CFM (5.5 L/min), providing highly efficient localized cooling for compact electronic systems.

Unlike conventional cooling fans, the CHIP FAN supports direct SMT mounting and can be integrated onto PCBs like standard electronic components, opening a new era of embedded active cooling.

Key Specifications

From Cooling Module to Electronic Component

Traditional cooling fans require motors, bearings, blades, and dedicated housings, adding complexity and occupying valuable system space.

The ADW CHIP FAN transforms thermal management by integrating a micro jet structure into a MEMS device that can be mounted directly onto a PCB using standard SMT assembly processes.

For the first time, active cooling becomes a true electronic component rather than a separate mechanical module.

Ultra-Low Power Consumption

Power-sensitive devices such as wearable electronics, optical communication modules, and portable projection systems require efficient thermal management without compromising battery life.

Operating at only 0.2 W, the CHIP FAN enables continuous active cooling while maintaining exceptional energy efficiency.

No Moving Parts, Silent Operation, Extended Lifetime

Unlike traditional fans, the CHIP FAN contains:

• No bearings
• No rotating blades
• No mechanical friction

Using piezoelectric-driven micro jet technology, it generates directed airflow without mechanical rotation, resulting in:

• Silent operation
• Zero electromagnetic interference
• Minimal wear
• Significantly extended operational lifetime

These characteristics make it ideal for medical devices, precision instruments, and premium consumer electronics.

Modular Array Design for Scalable Cooling

A single CHIP FAN effectively addresses localized hotspots.

For larger thermal loads, multiple units can be combined into 2-, 4-, or 6-unit arrays to achieve increased airflow and broader cooling coverage while maintaining an ultra-thin profile.

This modular approach provides designers with unprecedented flexibility for thermal management across different power levels and system architectures.

Application Areas

Mobile Devices

• Smartphones
• Tablets
• Fast-charging power modules

Wearables and AR Devices

• Smartwatches
• AR/VR glasses
• Compact wearable electronics

Optical Communication Equipment

• Optical transceivers
• High-speed communication modules

Projection and Display Systems

• Pico projectors
• Micro display engines

Medical Electronics

• Portable diagnostic equipment
• Precision monitoring systems

High-Density Computing

• Multi-chip modules
• AI edge computing devices
• Embedded processing systems

Active Cooling Integrated into the Future of Electronics

Combining MEMS manufacturing, SMT compatibility, ultra-low power consumption, and scalable array configurations, the ADW CHIP FAN represents a breakthrough in active thermal management. More than a cooling device, it is a new class of electronic component designed for next-generation compact and high-performance systems.

MEMS Technology. SMT Integration. Scalable Cooling. ADW CHIP FAN — Making Active Cooling Part of the Chip.